Keisuke Yoshida

Device simulation for evaluating effects of mechanical stress on semiconductor devices: Impact of stress-induced variation of electron effective mass

N. Miyazaki, M. Koganemaru, T. Ikeda, 2010, 3rd Electronics System Integration Technology Conference ESTC.

Mechanics of a Snap Fit.

H. Wada, Keisuke Yoshida, 2020, Physical review letters.

Noninvasive measurement of thermal conductivity and thermal diffusivity of biological materials (preliminary examination of heat transfer models and measurement accuracy)

H. Takamatsu, M. Fujii, Keisuke Yoshida, 2006 .

Development and flow evaluation of electro-rheological nano-suspensions

T. Tsujita, M. Nakano, R. Akiyama, 2011 .

Speciation by XANES of copper migrated into compacted bentonite using electromigration techniques

K. Idemitsu, T. Arima, Y. Inagaki, 2021, MRS Advances.

An Evaluation Method for Electrical Characteristics Variations on nMOSFETs under Uniaxial Stress Using Drift-Diffusion Device Simulation

N. Miyazaki, M. Koganemaru, T. Ikeda, 2012 .

Fracture Mechanics Investigation of MgO–C Bricks for Steelmaking by Bending and Fatigue Failure Tests Along with X-Ray CT Scan Observation

Michihiro Kuwayama, Keisuke Yoshida, Y. Kiyota, 2013 .