Je-Hyoung Park

Fast Evaluation Method for Transient Hot Spots in VLSI ICs in Packages

Sung-Mo Kang, Je-Hyoung Park, Ali Shakouri, 2008, 9th International Symposium on Quality Electronic Design (isqed 2008).

Fast Evaluation Method for Transient Hot Spots in VLSI ICs in Packages

Sung-Mo Kang, Je-Hyoung Park, Ali Shakouri, 2008, ISQED 2008.

Methodology on thermal prediction of high-power memory modules considering air velocity, chip size and power consumption

Je-Hyoung Park, Jae-Sang Baik, Jin-Kyu Chang, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

Method of images for the fast calculation of temperature distributions in packaged VLSI chips

Je-Hyoung Park, Sung-Mo Kang, A. Shakouri, 2007, 2007 13th International Workshop on Thermal Investigation of ICs and Systems (THERMINIC).

Fast Computation of Temperature Profiles of VLSI ICs with High Spatial Resolution

Sung-Mo Kang, Je-Hyoung Park, A. Shakouri, 2008, 2008 Twenty-fourth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices

Sung-Mo Kang, Jose Renau, Je-Hyoung Park, 2014, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

Experimental validation of the power blurring method

Je-Hyoung Park, Ali Shakouri, Sangho Shin, 2010, 2010 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

Ultra Fast Calculation of Temperature Profiles of VLSI ICs in Thermal Packages Considering Parameter Variations

Sung-Mo Kang, Je-Hyoung Park, Ali Shakouri, 2007 .