Ming Li

Design and assembly of a double-sided 3D package with a controller and a DRAM stack

S. K. Sitaraman, Xi Liu, J. Cline, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips

Sheng-Tsai Wu, John H. Lau, Heng-Chieh Chien, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Process integration of 3D Si interposer with double-sided active chip attachments

John H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.