Dave Hetzer

发表

Driving down defect density in composite EUV patterning film stacks

John Arnold, Nelson Felix, Cody Murray, 2017, Advanced Lithography.

Track based techniques to improve high-resolution EUV patterning defectivity

Nelson Felix, Cody Murray, Eric Liu, 2018, Photomask Technology.

Application of scatterometry for CD and profile metrology in 193-nm lithography process development

Wenge Yang, Chih-Ming Ke, Tsai-Sheng Gau, 2003, SPIE Advanced Lithography.

Strategies for aggressive scaling of EUV multi-patterning to sub-20 nm features

Joe Lee, Akiteru Ko, Cody Murray, 2020, Advanced Lithography.

Investigation of lithographic feature characteristics using UV cure as a pitch doubling stabilization technology for the 32nm node and beyond

Satoru Shimura, Karen Petrillo, Matthew E. Colburn, 2010, Advanced Lithography.

Utilization of spin-on and reactive ion etch critical dimension shrink with double patterning for 32 nm and beyond contact level interconnects

Andrew Metz, Karen Petrillo, Dave Horak, 2009, Advanced Lithography.

Coater/developer based techniques to improve high-resolution EUV patterning defectivity

Yongan Xu, Akiteru Ko, Nelson Felix, 2017, Photomask Technology.

The defect mitigation on EUV stack by track based technology

Nelson Felix, Cody Murray, Karen Petrillo, 2019, Advanced Lithography.

EUV patterning successes and frontiers

Yongan Xu, Nelson Felix, Hao Tang, 2016, SPIE Advanced Lithography.

Assessment of negative tone development challenges

Alan C. Thomas, Sohan Singh Mehta, Jerome Wandell, 2012, Other Conferences.

90-nm lithography process characterization using ODP scatterometry technology

Wenge Yang, Jacky Huang, Chih-Ming Ke, 2004, SPIE Advanced Lithography.

Defect detection strategies and process partitioning for single-expose EUV patterning

Nelson Felix, Koichiro Tanaka, Eric Liu, 2018 .

CD and profile metrology of embedded phase shift masks using scatterometry

Ki-Ho Baik, Sanjay Yedur, Kyung M. Lee, 2006, European Mask and Lithography Conference.

Application of integrated scatterometry measurements for a wafer-level litho feedback loop in a high-volume 300 mm DRAM production environment

Thomas Marschner, Dave Hetzer, Steffen Hornig, 2006, SPIE Advanced Lithography.

High speed EUV using post processing and self-aligned double patterning as a speed enhancement technique

Craig Higgins, Jerome Wandell, Kathleen Nafus, 2014, Advanced Lithography.

Defect detection strategies and process partitioning for SE EUV patterning

Jeffrey Shearer, John Arnold, Nelson Felix, 2018, Advanced Lithography.

Qualification of an integrated scatterometer for CD measurements of sub-100nm resist structures in a high-volume 300mm DRAM production environment

Matthias Voigt, Michael Friedrich, Thomas Marschner, 2005, SPIE Advanced Lithography.

Controlling 2D aspect ratio of elliptical contact level interconnects utilizing spin-on and reactive ion etch critical dimension shrink for the 22-nm node

Karen Petrillo, Andrew Metz, Shinichiro Kawakami, 2010, Advanced Lithography.

Defectivity issues in topcoat-free photoresists

Will Conley, Youri van Dommelen, Karen Petrillo, 2009, Advanced Lithography.

Effect and procedures of post exposure bake temperature optimization on the CD uniformity in a mass production environment

Göran Fleischer, Dave Hetzer, Steffen Hornig, 2007, SPIE Advanced Lithography.

Coater/developer and new underlayer application to sub-30nm process

Satoru Shimura, Shinichiro Kawakami, Naoki Shibata, 2021, International Conference on Extreme Ultraviolet Lithography 2021.