B. Aventurier

Through silicon vias technology for CMOS image sensors packaging

X. Baillin, C. Brunet-Manquat, N. Sillon, 2008, 2008 58th Electronic Components and Technology Conference.

Wafer level packaging technology development for CMOS image sensors using Through Silicon Vias

C. Brunet-Manquat, N. Sillon, D. Henry, 2008, 2008 2nd Electronics System-Integration Technology Conference.

Through Silicon Vias Technology for CMOS Image Sensors Packaging: Presentation of Technology and Electrical Results

R. Anciant, P. Chausse, N. Hotellier, 2008, 2008 10th Electronics Packaging Technology Conference.

Study of the pixel-pitch reduction for HgCdTe infrared dual-band detectors

O. Gravrand, Jean-Paul Chamonal, Gérard Destefanis, 2004 .