I. Touet

Microstructure and electromigration in copper damascene lines

Lucile Arnaud, Y. Gobil, D. Mariolle, 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

Microstructure and electromigration in copper damascene lines

Lucile Arnaud, Y. Gobil, D. Mariolle, 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

Electromigration Characterization Versus Texture Analysis in Damascene Copper Interconnects

Lucile Arnaud, R. Gonella, G. Lormand, 2000 .