Kyoungchoul Koo

发表

Mobile-oriented CPS (Chip-Package-System) integrated power integrity techniques at early chip design stage

Youngsoo Lee, Kyoungchoul Koo, Woncheol Baek, 2014, 2014 IEEE International Symposium on Electromagnetic Compatibility (EMC).

Analysis of power/ground noise effect on performance degradation of analog-to-digital converter

Joungho Kim, Woojin Ahn, Jeonghyeon Cho, 2009, 2009 11th Electronics Packaging Technology Conference.

Through-Silicon-Via-Based Decoupling Capacitor Stacked Chip in 3-D-ICs

Joungho Kim, Jun So Pak, Eunseok Song, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC

Joungho Kim, Myunghoi Kim, Kyoungchoul Koo, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Design and experimental verification of on-chip signal integrity analyzer (OSIA) scheme for eye diagram monitoring of a high-speed serial link

Joungho Kim, Sunkyu Kong, Myunghoi Kim, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Analytical expressions for maximum transferred power in wireless power transfer systems

Seungyoung Ahn, Joungho Kim, Sunkyu Kong, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

An On-Chip Electromagnetic Bandgap Structure using an On-Chip Inductor and a MOS Capacitor

Chulsoon Hwang, Joungho Kim, Jun So Pak, 2011, IEEE Microwave and Wireless Components Letters.

Fast decap assignment algorithm for optimization of power distribution networks

Tao Wang, Kyoungchoul Koo, James Drewniak, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Improved noise isolation design of UHF mobile radio frequency identification reader system in package

Joungho Kim, Youngwon Kim, Jongbae Park, 2006, 2006 8th Electronics Packaging Technology Conference.

Fast Algorithm for Minimizing the Number of decap in Power Distribution Networks

Tao Wang, James L. Drewniak, Kyoungchoul Koo, 2018, IEEE Transactions on Electromagnetic Compatibility.

Design of coupled resonators for wireless power transfer to mobile devices using magnetic field shaping

Junseok Park, Wonkyum Lee, Woojin Ahn, 2012, 2012 IEEE International Symposium on Electromagnetic Compatibility.

Noise isolation modeling of partial EBG power bus using segmentation method and cavity model in multi-layer PCBs

Joungho Kim, Myunghoi Kim, Kyoungchoul Koo, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Chulsoon Hwang, Joungho Kim, Jonghoon Kim, 2012, IEEE Transactions on Electromagnetic Compatibility.

Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)

Joungho Kim, Chulsoon Hwang, Myunghoi Kim, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Sparse Emission Source Microscopy for Rapid Emission Source Imaging

Ling Zhang, David Pommerenke, James L. Drewniak, 2017, IEEE Transactions on Electromagnetic Compatibility.

Vertical Noise Coupling From On-Chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3-D-IC

Jiseong Kim, Joungho Kim, Jonghoon J. Kim, 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Coupling Path Visualization and EMI Mitigation for Flyover QSFP Connectors

Atieh Talebzadeh, David Pommerenke, Hongyu Li, 2020, IEEE Transactions on Electromagnetic Compatibility.

Analysis of die-to-die vertical crosstalk between Clock-tree and Voltage Controlled Oscillator in 3-D IC

Joungho Kim, Kyoungchoul Koo, Sangrok Lee, 2011, 2011 IEEE International Symposium on Electromagnetic Compatibility.

Extended CPM for system power integrity analysis

Kyoungchoul Koo, 2015, 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS).

Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Joungho Kim, Jiseong Kim, Myunghoi Kim, 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

Modeling and Experimental Verification to Investigate the Effect of Power Supply Noise Imbalance on 900MHz Differential LNA

Joungho Kim, Jongjoo Shim, Yujeong Shim, 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.

Noise Isolation Modeling and Experimental Validation of Power Distribution Network in Chip-Package

Joungho Kim, Changwook Yoon, Hyunjeong Park, 2007, 2007 IEEE International Symposium on Electromagnetic Compatibility.

Analysis of the Effect of Digital Power Ground Noise on Active Balun in UHF RFID SiP

Joungho Kim, Chunghyun Ryu, Changwook Yoon, 2007, 2007 9th Electronics Packaging Technology Conference.

Vertical noise coupling on wideband low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC

Joungho Kim, Kyoungchoul Koo, Sangrok Lee, 2011, 2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits.

SI and EMI performance comparison of standard QSFP and flyover QSFP connectors for 56+ Gbps applications

David Pommerenke, James L. Drewniak, Atieh Talebzadeh, 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

Modeling and Analysis of Power Supply Noise Imbalance on Ultra High Frequency Differential Low Noise Amplifiers in a System-in-Package

Jaemin Kim, Joungho Kim, Jeongsik Yoo, 2010, IEEE Transactions on Advanced Packaging.

Modeling of Eye-Diagram Distortion and Data-Dependent Jitter in Meander Delay Lines on High-Speed Printed Circuit Boards (PCBs) Based on a Time-Domain Even-Mode and Odd-Mode Analysis

Jaemin Kim, Joungho Kim, Jun So Pak, 2008, IEEE Transactions on Microwave Theory and Techniques.

Co-modeling, Experimental Verification, and Analysis of Chip-Package Hierarchical Power Distribution Network

Joungho Kim, Hyungsoo Kim, Changwook Yoon, 2008, IEICE Trans. Electron..

Modeling andExperimental Verification toInvestigate theEffect ofPowerSupply Noise Imbalance on900MHzDifferential LNA

Jongjoo Shim, Kyoungchoul Koo, 2008 .

Modeling and Measurement of Power Supply Noise Effects on an Analog-to-Digital Converter Based on a Chip-PCB Hierarchical Power Distribution Network Analysis

Joungho Kim, Bumhee Bae, Jun So Pak, 2013, IEEE Transactions on Electromagnetic Compatibility.

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Seungyoung Ahn, Chulsoon Hwang, Joungho Kim, 2013, IEEE Transactions on Electromagnetic Compatibility.

Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

Joungho Kim, Jun So Pak, Eunseok Song, 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems.

Hybrid modeling and analysis of power supply noise effects on analog-to-digital converter considering hierarchical PDNs

Joungho Kim, Woojin Ahn, Bumhee Bae, 2010, 2010 IEEE Electrical Design of Advanced Package & Systems Symposium.

Modeling and Analysis of a Power Distribution Network in TSV-Based 3-D Memory IC Including P/G TSVs, On-Chip Decoupling Capacitors, and Silicon Substrate Effects

Joungho Kim, Chulsoon Hwang, Heegon Kim, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Effect of power supply imbalance on NF of CMOS low noise amplifier for UHF RFID applications

Joungho Kim, Jongjoo Shim, Hyunjeong Park, 2008, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility.

Vertical Electromagnetic Bandgap Structure for Noise Suppression in Single-ended and Differential Signaling on a Multi-layer Backplane Board

Joungho Kim, Chulsoon Hwang, Kyoungchoul Koo, 2009, 2009 20th International Zurich Symposium on Electromagnetic Compatibility.

Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC

Joungho Kim, Myunghoi Kim, Kyoungchoul Koo, 2011 .

Vertical Inductive Bridge EBG (VIB-EBG) Structure With Size Reduction and Stopband Enhancement for Wideband SSN Suppression

Joungho Kim, Jiseong Kim, Myunghoi Kim, 2012, IEEE Microwave and Wireless Components Letters.