Julia Cline

3D Si Interposer Design and Electrical Performance Study

Kevin Cai, J. Cline, Julia Cline, 2013 .

Thermal and mechanical design and analysis of 3D IC interposer with double-sided active chips

Sheng-Tsai Wu, John H. Lau, Heng-Chieh Chien, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Process integration of 3D Si interposer with double-sided active chip attachments

John H. Lau, Ming-Jer Kao, Tzu-Kun Ku, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Assessing 3D shear stress–strain properties of composites using Digital Image Correlation and finite element analysis based optimization

Andrew Makeev, Brian Shonkwiler, Guillaume Seon, 2015 .