Jeffrey T. Wetzel

Low-k dielectrics characterization for damascene integration

Douglas Yu, K. A. Monnig, Changming Jin, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Electromigration in multilevel interconnects with polymeric low-k interlevel dielectrics

Hisao Kawasaki, Paul S. Ho, C. Capasso, 2001 .

Electrical Reliability of Cu and Low- K Dielectric Integration

Alvin Leng Sun Loke, Paul H. Townsend, S. Wong, 1998 .

Electromigration in multi-level interconnects with polymeric low-k interlevel dielectrics

Hisao Kawasaki, Paul S. Ho, C. Capasso, 2000, Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407).

Evaluation of ultra-low-k dielectric materials for advanced interconnects

Shisheng Lin, Jeffrey T. Wetzel, C. Jin, 2001 .

Copper drift in low-K polymer dielectrics for ULSI metallization

Alvin Leng Sun Loke, Changsup Ryu, S. Wong, 1998, 1998 Symposium on VLSI Technology Digest of Technical Papers (Cat. No.98CH36216).