Meiying Su

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process

Jun Li, Liqiang Cao, Cheng Chen, 2018, Microelectron. Reliab..

Optimization Design of 2.5D TSV Package Using Thermo-Electrical Co-Simulation Method

Fengman Liu, Liqiang Cao, Jun Li, 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC).

Thermal characterization of a novel 3D stacked package structure by CFD simulation

Fengman Liu, Liqiang Cao, Fengze Hou, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).