Bei Deng

Effects of various assembly and reliability stresses on chip to package interaction

Li Lin, Shiguo Rao, Xiaopeng Xu, 2014, 2014 IEEE International Reliability Physics Symposium.

Design for reliability with a new modeling methodology for Chip to Package Interaction

Shiguo Rao, Xiaopeng Xu, Bei Deng, 2015, 2015 IEEE 65th Electronic Components and Technology Conference (ECTC).