Z.P. Wang

发表

Stress analysis of interconnect structure in COF by finite element method

Y. Peng, Z.P. Wang, J. Chan, 2003, Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003..

A study of degradation of ACF joints in chip-on-glass assenblies

Y. Lin, Xu Chen, Z.P. Wang, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..

Role of bonding temperature and voltage in silicon-to-glass anodic bonding

Z. P. Wang, J. Wei, H. Xie, 2002, 4th Electronics Packaging Technology Conference, 2002..

Interfacial fracture toughness test methodology for flip chip underfill encapsulant

Z. P. Wang, X. Shi, X.Q. Shi, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

In-situ moire interferometry technique and its applications to microelectronic packages

X.Q. Shi, X.Q. Shi, Z.P. Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Modeling interface fracture in flip chip assembly

X.Q. Shi, H. Pang, Z.P. Wang, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints

Z. P. Wang, X. Shi, X.Q. Shi, 2000, International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458).

Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model

Wei Zhou, H.L.J. Pang, X.Q. Shi, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

Sensitivity study of temperature and strain rate dependent properties on solder joint fatigue life

X.Q. Shi, H. Pang, Z.P. Wang, 1998, Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235).

Methodology for a highly accelerated solder joint reliability test

K. H. Ang, X.Q. Shi, H. Pang, 2000, Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456).

On the moduli of viscoelastic materials

J. Pang, X.Q. Shi, X.R. Zhang, 2002, 4th Electronics Packaging Technology Conference, 2002..

Challenges in the reliability study of chip-on-glass (COG) technology for mobile display applications

Z.P. Wang, Z.P. Wang, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Room-temperature growth and characterization of iron-carbon nanocomposite fibers

Y. Hayashi, M. Tanemura, Z.P. Wang, 2008, 2008 2nd IEEE International Nanoelectronics Conference.

Experimental modal analysis of PBGA printed circuit board assemblies

Fook Fah Yap, R. M. Lin, H.L.J. Pang, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

An experimental study of degradation of anisotropic conductive adhesive joints

Xu Chen, Y. Lin, Xu Chen, 2006, Thermal and Thermomechanical Proceedings 10th Intersociety Conference on Phenomena in Electronics Systems, 2006. ITHERM 2006..