Weiqun Peng

Failure Mechanisms and Crack Propagation Paths in Thermally Aged Pb-Free Solder Interconnects

Eduardo Monlevade, W. Peng, Weiqun Peng, 2007 .

Effect of Thermal Aging on Drop Performance of Chip Scale Packages with SnAgCu Solder Joints on Cu Pads

W. Peng, Weiqun Peng, Marco Elisio Marques, 2007 .