Colin McDonough

Effects of Copper Plasticity on the Induction of Stress in Silicon from Copper Through-Silicon Vias (TSVs) for 3D Integrated Circuits

Wei Wang, Larry Smith, Benjamin Backes, 2012, J. Electron. Test..

Demonstration of an optical chip-to-chip link in a 3D integrated electronic-photonic platform

Douglas Coolbaugh, Vladimir Stojanovic, Sen Lin, 2015, ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC).

Argos: Building a Web-Centric Application Platform on Top of Android

Roy Want, Rich Gossweiler, James Lin, 2011, IEEE Pervasive Computing.

The AIM Photonics MPW: A Highly Accessible Cutting Edge Technology for Rapid Prototyping of Photonic Integrated Circuits

Douglas D. Coolbaugh, Nicholas M. Fahrenkopf, Erman Timurdogan, 2019, IEEE Journal of Selected Topics in Quantum Electronics.

Thermal and spatial profiling of TSV-induced stress in 3DICs

Wei Wang, Benjamin Backes, Colin McDonough, 2011, 2011 International Reliability Physics Symposium.