N. Marenco

Vacuum Encapsulation of Resonant MEMS Sensors by Direct Chip-to-Wafer Stacking on ASIC

W. Reinert, G. Bock, S. Guadagnuolo, 2008, 2008 10th Electronics Packaging Technology Conference.

Investigation of key technologies for System-in-Package integration of inertial MEMS

W. Reinert, S. Guadagnuolo, A. Conte, 2009, 2009 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS.

METALORGANIC VAPOR-PHASE EPITAXY-GROWN ALGAN MATERIALS FOR VISIBLE-BLIND ULTRAVIOLET PHOTODETECTOR APPLICATIONS

Bernard Beaumont, E. Muñoz, Eva Monroy, 1999 .