文
论文分享
演练场
杂货铺
论文推荐
字
编辑器下载
登录
注册
J. DeVoe
发表
An investigation of board level effects on compact thermal models of electronic chip packages
J. DeVoe, A. Ortega, 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).