Ching-Hua Wang

Three-Dimensional $\hbox{4F}^{2}$ ReRAM With Vertical BJT Driver by CMOS Logic Compatible Process

Heng-Yuan Lee, Ming-Jinn Tsai, Ya-Chin King, 2011, IEEE Transactions on Electron Devices.

Magnetic Wireless Interlayer Transmission Through Perpendicular MTJ for 3-D IC Applications

Ming-Jinn Tsai, Ya-Chin King, Chrong Jung Lin, 2014, IEEE Transactions on Electron Devices.

A novel high-density embedded AND-type split gate flash memory

Ya-Chin King, Chrong Jung Lin, Chiu-Wang Lien, 2014 .