Justin Chow

A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect

Abhijit Chatterjee, Thomas Moon, Suresh K. Sitaraman, 2018, 2018 IEEE 27th Asian Test Symposium (ATS).

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

Xi Liu, Ye Tian, Suresh K. Sitaraman, 2014, Microelectron. Reliab..

Comparison of Sn-Ag-Cu Solder Alloy Intermetallic Compound Growth Under Different Thermal Excursions for Fine-Pitch Flip-Chip Assemblies

Suresh K. Sitaraman, Justin Chow, Yi Ping Wu, 2013, Journal of Electronic Materials.

Adaptive Curvature Flexure Test to Assess Flexible Electronic Systems

Justin Chow, Suresh Sitaraman, Jeffrey Meth, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).