R. Subrahmanyan

Effects of Rework on the Reliability of Pin Grid Array Interconnects

J. Lau, S. Leung, R. Subrahmanyan, 1991 .

Two-dimensional simulation of band-to-band tunneling in an LDD-MOSFET: explanation of experimental results and prediction of new phenomena

M. Orlowski, R. Subrahmanyan, P. Blakey, 1990, Digest of Technical Papers.1990 Symposium on VLSI Technology.

A damage integral approach to thermal fatigue of solder joints

R. Subrahmanyan, J. R. Wilcox, Che-Yu Li, 1989, Proceedings., 39th Electronic Components Conference.

Fatigue Analysis of a Ceramic Pin Grid Array Soldered to an Orthotropic Epoxy Substrate

J. Lau, R. Subrahmanyan, S. Erasmus, 1991 .

New TCE-matched glass-ceramic multi-chip module. I. Electrical design and characterization

R. Subrahmanyan, J. P. Krusius, W. E. Pence, 1989, Proceedings., 39th Electronic Components Conference.

A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints

R. Subrahmanyan, Donald S. Stone, J. R. Wilcox, 1991 .