S.C. Kallolimath

Investigation of nonuniform moisture distribution on determination of hygroscopic swelling coefficient and finite element modeling for a flip chip package

Jiang Zhou, Jiang Zhou, S. Lahoti, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..