M. Kohara

Thermal Stress-Free Package for Flip-Chip Devices

M. Kohara, M. Hatta, H. Genjyo, 1984 .

A bipolar 18K-gate variable size cell masterslice

M. Kohara, K. Sakaue, T. Hirao, 1986 .

High Thermal Conduction Package Technology for Flip Chip Devices

M. Kohara, Hideki Shibata, H. Nakata, 1983 .