W. Oesterle

Pt thin-film metallization for FC-bonding using SnPb60/40 solder bump metallurgy

F. Reier, A. Klein, A. Klein, 1998 .

Oxidation and reduction kinetics of eutectic SnPb, InSn and AuSn: a knowledge base for fluxless solder bonding applications

M. Fanciulli, W. Pittroff, R. Adolphi, 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.