Samuel H. Kim
发表
F. Medjdoub,
G. Pavlidis,
S. Graham,
2019,
IEEE Electron Device Letters.
Jingjing Shi,
S. Graham,
Zhe Cheng,
2021,
Ultrawide Bandgap Semiconductors.
A. Rattner,
R. Pearson,
Sukwon Choi,
2020
.
K. Goodson,
S. Graham,
F. Faili,
2016
.
Ramchandra M. Kotecha,
Xuhui Feng,
S. Narumanchi,
2018,
2018 IEEE 6th Workshop on Wide Bandgap Power Devices and Applications (WiPDA).
Jared M. Johnson,
Chao Yuan,
Jingjing Shi,
2021,
ACS applied materials & interfaces.
Kyle J. Liddy,
G. Jessen,
K. Chabak,
2022,
IEEE Transactions on Electron Devices.
Robert H. Montgomery,
J. Speck,
Chao Yuan,
2020
.
Kyle J. Liddy,
K. Chabak,
Sukwon Choi,
2022,
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Robert H. Montgomery,
J. Speck,
E. Farzana,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
Robert H. Montgomery,
J. Speck,
Chao Yuan,
2021
.
Kyle J. Liddy,
K. Chabak,
Sukwon Choi,
2023,
IEEE Transactions on Electron Devices.
G. Jessen,
D. Shoemaker,
K. Chabak,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
D. Twitchen,
C. McGray,
K. Goodson,
2021,
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
Ramchandra M. Kotecha,
S. Narumanchi,
W. Metzger,
2019,
ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems.
C. Nordquist,
Yiwen Song,
Sukwon Choi,
2021,
IEEE Transactions on Components, Packaging and Manufacturing Technology.