M. Parker

Thermal modelling and optimisation of hot solder dip process

C. Bailey, S. Stoyanov, J. Roulston, 2012, 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Modelling and testing the impact of hot solder dip process on leaded components

M. O. Alam, C. Bailey, S. Stoyanov, 2012, 2012 35th International Spring Seminar on Electronics Technology.