T. Hoang

发表

J. Golinval, L. Noels, M. Arnst, 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE).

A. Habraken, L. Duchene, H. Tran, 2022, Journal of Intelligent Manufacturing.