P.S. Andry

3D Chip Stacking Technology with Low-Volume Lead-Free Interconnections

B. Dang, Sung K. Kang, B. Webb, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.

Characterization of stacked die using die-to-wafer integration for high yield and throughput

B. Dang, K. Sakuma, E. Sprogis, 2008, 2008 58th Electronic Components and Technology Conference.

A CMOS-compatible process for fabricating electrical through-vias in silicon

J. Knickerbocker, E. Sprogis, P. Andry, 2006, 56th Electronic Components and Technology Conference 2006.

Pb-free microjoints (50 /spl mu/m pitch) for the next generation microsystems: the fabrication, assembly and characterization

J. Knickerbocker, E. Sprogis, K. Lee, 2006, 56th Electronic Components and Technology Conference 2006.

Assembly, Characterization, and Reworkability of Pb-free Ultra-Fine Pitch C4s for System-on-Package

A. Sharma, B. Dang, K. Sakuma, 2007, 2007 Proceedings 57th Electronic Components and Technology Conference.