Zhen-Ying Hsieh

Improvement of Printed Circuit Board Assembly Process in 2.4GHz RF Circuit Products

Mu-Chun Wang, Zhen-Ying Hsieh, Ting-Yu Yang, 2008 .

Design of a 0.18um Stable Non-Volatile Boost Circuit in High/Low Temperature Operation

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2007 .

Investigation of Dicing Saw Methods Impacting Back-End Assembly Process

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2008 .

A 2.4-GHz 0.18μm Full-CMOS Single-Stage Class-E Power Amplifier With Temperature Effect for ISM Band Wireless Communication

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2007 .

Correcting Front-End RF Impedance Mismatch for 2.4GHz Wireless Long-Distance Data Transmission

Mu-Chun Wang, Zhen-Ying Hsieh, Chia-Hao Tu, 2008 .

Avoidance of Bonding Pad Contamination Affecting Back-End Assembly Process

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2008 .

Simulation and Improvement of 5GHz Power Divider on FR-4 PCB

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2008 .

Visible Light Source Disturbing the Source/Drain Current of CLC Poly-Si n-TFT Device

Mu-Chun Wang, Zhen-Ying Hsieh, Jia-Min Shieh, 2008 .

Back-Side Wafer Grinding Quality Affecting Back-End Assembly Process for LCD Driver ICs

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2008 .

A 5.8GHz Band-Pass Filter With an Active Inductor Through 0.18μm Full-CMOS Process for Wireless Transceivers

Mu-Chun Wang, Zhen-Ying Hsieh, Shuang-Yuan Chen, 2007 .

Analysis of promising copper wire bonding in assembly consideration

Mu-Chun Wang, Zhen-Ying Hsieh, Chii-Ruey Lin, 2009, 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference.