Christopher Kapusta

Reliability of POL-kw power modules

Hitoshi Ito, Liang Yin, Tadashi Arai, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Electronic packaging of SiC MOSFET-based devices for reliable high temperature operation

Liang Yin, Cheng-Po Chen, Christopher Kapusta, 2015, 2015 IEEE International Symposium on Circuits and Systems (ISCAS).

A hydromechanical biomimetic cochlea: experiments and models.

Thomas G Bifano, Christopher Kapusta, Aleks Zosuls, 2006, The Journal of the Acoustical Society of America.