H. J. van de Wiel

Cu-Sn transient liquid phase wafer bonding for MEMS applications

V. Dragoi, C. Flötgen, M. Pawlak, 2013, Microtechnologies for the New Millennium.

Roll-to-roll embedded conductive structures integrated into organic photovoltaic devices

H. J. van de Wiel, Y. Galagan, W. Groen, 2013, Nanotechnology.

Direct strain energy harvesting in automobile tires using piezoelectric PZT–polymer composites

H. J. van de Wiel, Wilhelm A. Groen, D. A. van den Ende, 2011 .

Vibration characterization of a MEMS 3D force sensor

H. J. van de Wiel, A. Pongrácz, H. Fischer, 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems.

Systematic characterization of key parameters of hermetic wafer-level Cu-Sn SLID bonding

H. J. van de Wiel, Astrid-Sofie B. Vardøy, M. Taklo, 2013, 2013 Eurpoean Microelectronics Packaging Conference (EMPC).

Characterization of hermetic wafer-level Cu-Sn SLID bonding

H. J. van de Wiel, Astrid-Sofie B. Vardøy, M. Taklo, 2012, 2012 4th Electronic System-Integration Technology Conference.

Inter-laboratory, time, and fitness-for-purpose aspects of effective validation

H. J. van de Wiel, H. Voet, H. V. D. Wiel, 1999 .