B.A. Zahn

Solder joint fatigue life model methodology for 63Sn37Pb and 95.5Sn4Ag0.5Cu materials

B.A. Zahn, B. Zahn, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Finite element based solder joint fatigue life predictions for a same die size-stacked-chip scale-ball grid array package

B.A. Zahn, B. Zahn, 2002, 27th Annual IEEE/SEMI International Electronics Manufacturing Technology Symposium.