J.B. Bernstein

Reliability Simulation and Design Consideration of High Speed ADC Circuits

Jun Dai, Jin Qin, Baoguang Yan, 2008, 2008 IEEE International Integrated Reliability Workshop Final Report.

SRAM circuit-failure modeling and reliability simulation with SPICE

Xiaojun Li, Jin Qin, J.B. Bernstein, 2006, IEEE Transactions on Device and Materials Reliability.

Compact Modeling of MOSFET Wearout Mechanisms for Circuit-Reliability Simulation

Xiaojun Li, Jin Qin, J.B. Bernstein, 2008, IEEE Transactions on Device and Materials Reliability.

Supply signal fluctuations due to chip power grid resonance — a new reliability concern

J.B. Bernstein, P. Livshits, M. Gurfinkel, 2008, 2008 IEEE International Reliability Physics Symposium.

Product Reliability Trends, Derating Considerations and Failure Mechanisms with Scaled CMOS

Yuan Chen, J.B. Bernstein, M. White, 2006, 2006 IEEE International Integrated Reliability Workshop Final Report.

Local Oscillations of On-Die Supply Voltage—A Reliability Issue

J.B. Bernstein, P. Livshits, M. Gurfinkel, 2009, IEEE Transactions on Device and Materials Reliability.

Failure dynamics of the IGBT during turn-off for unclamped inductive loading conditions

J.B. Bernstein, D.W. Berning, Chih-Chieh Shen, 1998, Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242).

Acceleration factors and mechanistic study of progressive breakdown in small area ultra-thin gate oxides

J.S. Suehle, J.B. Bernstein, B. Zhu, 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.

A new SPICE reliability simulation method for deep submicrometer CMOS VLSI circuits

Xiaojun Li, Jin Qin, J.B. Bernstein, 2006, IEEE Transactions on Device and Materials Reliability.

Reliability Simulation and Circuit-Failure Analysis in Analog and Mixed-Signal Applications

Jun Dai, Jin Qin, Baoguang Yan, 2009, IEEE Transactions on Device and Materials Reliability.