G. Koziol

Stencil Design for Lead-Free Reflow Process

W. Steplewski, G. Koziol, G. Koziol, 2007, 2007 30th International Spring Seminar on Electronics Technology (ISSE).

Laser prototype system for creating high density patterns on PCB

J. Borecki, R. Barbucha, J. Mizeraczyk, 2008, Photonics Prague.

Problems and preliminary trials in lead free soldering

J. Borecki, G. Koziol, H. Hackiewicz, 2004, 27th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2004..

Applying of Stacked Microvias in Printed Circuit Board

G. Koziol, W. Falinski, 2006, 2006 29th International Spring Seminar on Electronics Technology.

WIELOWARSTWOWE PLYTKI DRUKOWANE Z OTWORAMI NIEPRZELOTOWYMI I MIKROOTWORAMI

G. Koziol, L. Kowalczyk, 1999 .

Laser structuring of fine line printed circuit boards

J. Borecki, G. Koziol, W. Falinski, 2005, 28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005..

Zastosowanie metod elektrochemicznych do badania aktywatorów Sn/Pd stosowanych w technologii wytwarzania obwodów drukowanych

G. Koziol, J. Bielinski, 1998 .

Laser prototype system for creating high density patterns on PCB

J. Borecki, R. Barbucha, J. Mizeraczyk, 2009, International Symposium on High Power Laser Systems and Applications.

Assessment of lead-free solder pastes with different type of powder for fine-pitch application

J. Borecki, W. Steplewski, G. Koziol, 2008, 2008 31st International Spring Seminar on Electronics Technology.

Laser direct imaging of high density patterns on PCB covered by photoresist

J. Borecki, R. Barbucha, J. Mizeraczyk, 2007, International School on Quantum Electronics: Laser Physics and Applications.

An investigation of quality of the conductive lines deposited by inkjet

K. Janeczek, G. Koziol, Małgorzata Jakubowska, 2011, Symposium on Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments (WILGA).