Klaus Schock

发表

Repairing bonding wire connections using a microsoldering unit inside an SEM

Andrew Smith, Andreas Rummel, Klaus Schock, 2013, Microelectron. Reliab..

Current imaging, EBIC/EBAC, and electrical probing combined for fast and reliable in situ electrical fault isolation

Andreas Rummel, Klaus Schock, Matthias Kemmler, 2016, Microelectron. Reliab..

A new approach for making electrically conductive interconnections between small contacts in failure analysis

Andrew Smith, Andreas Rummel, Klaus Schock, 2012, Microelectron. Reliab..

Characterization and operation of a mechanically actuated silicon microgripper

Klaus Schock, Stephan Kleindiek, Monika Fleischer, 2006 .

Combining current imaging, EBIC/EBAC, and electrical probing for fast and reliable in situ electrical fault isolation

Andreas Rummel, Klaus Schock, Matthias Kemmler, 2016, 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).