N. Pham

Thermo-mechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's

E. Beyne, R. Jansen, B. Vandevelde, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Diamond bit cutting for processing high topography wafers

F. Iker, P. Soussan, A. Andrei, 2009, 2009 11th Electronics Packaging Technology Conference.

Development of vertical and tapered via etch for 3D through wafer interconnect technology

C. Van Hoof, P. De Moor, K. De Munck, 2006, 2006 8th Electronics Packaging Technology Conference.