Greg Heaslip

Analysis of Experimental Shock and Impact Response Data of a Printed Wire Board

Jeff Punch, Greg Heaslip, 2003 .

Board Level Drop Tests Comparing Lead-Free and Eutectic Solder Interconnects on a BGA Package for Mobile ICT Applications

Jeff Punch, Greg Heaslip, Bryan Rodgers, 2004 .

An Investigation of the Lead-Free Surface Mount Soldering Process: Solder Joint Evaluation and Process Optimisation

Jeff Punch, Eamonn Murphy, Greg Heaslip, 2004 .

The Response of Portable Electronics to Transient Conditions of Temperature and Humidity

Jeff Punch, Ronan Grimes, Greg Heaslip, 2005 .

A Simulated and Experimental Comparison of Lead-Free and Tin-Lead Solder Interconnect Failure Under Impact Stimuli

Jeff Punch, Greg Heaslip, Bryan Rogers, 2005 .