K. C. Toh

A Procedure for the Motion of Particle-Encapsulated Droplets in Microchannels

Y. F. Yap, T. N. Wong, L. Yobas, 2008 .

Temperature profile on a continuous moving surface subjected to a constant heat rate in a horizontal channel

K. Toh, K. C. Toh, W. K. Chan, 1995 .

Thermal contact conductance of typical interfaces in electronic packages under low contact pressures

K. K. Ng, K. C. Toh, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package

J. F. Leonard, H.L.J. Pang, C. K. Tan, 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).