Y. Harada

Highly reliable, 65 nm-node Cu dual damascene interconnects with full porous-SiOCH (k=2.5) films for low-power ASICs

T. Takeuchi, M. Tada, N. Inoue, 2004, Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004..

Dual hard mask process for low-k porous organosilica dielectric in copper dual damascene interconnect fabrication

Yoshihiro Hayashi, Munehiro Tada, Shuichi Saito, 2001, Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461).

Mechanical Property Control of Low-$k$ Dielectrics for Diminishing Chemical Mechanical Polishing (CMP)-Related Defects in Cu-Damascene Interconnects

Yoshihiro Hayashi, M. Tagami, F. Ito, 2004 .

Highly thermal-stable, plasma-polymerized BCB polymer film

Yoshihiro Hayashi, Keizo Kinoshita, Munehiro Tada, 2003 .

Cu dual damascene interconnects in porous organosilica film with organic hard-mask and etch-stop layers for 70 nm-node ULSIs

Yoshihiro Hayashi, Munehiro Tada, Shuichi Saito, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).