Yanan Zhang

发表

Lei Han, Yanan Zhang, 2009, 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.

Hongwei Deng, Chuanju Liu, Bo Ke, 2019, International Journal of Rock Mechanics and Mining Sciences.

Lei Han, Ya'nan Zhang, Lei Han, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Bo Ke, Hongwei Deng, Junren Deng, 2018, International Journal of Damage Mechanics.