Tadatomo Suga

Tadatomo Suga, Naoe Hosoda, Zhaohui Qiang, 2001, Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing.

A method and apparatus for testing electrical properties of an object to be tested

Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka, 2004 .

Growth Behavior of Au Films on SiO2 Film and Direct Transfer for Smoothing Au Surfaces

Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi, 2019, Int. J. Autom. Technol..

Low contact force probing on copper electrodes

Katsuya Okumura, Tadatomo Suga, Toshihiro Itoh, 2002, Proceedings. International Test Conference.

JIEP project for low-temperature lead-free solders and its report on questionnaire survey

Tadatomo Suga, M. Takeuchi, 2001, Proceedings Second International Symposium on Environmentally Conscious Design and Inverse Manufacturing.

Technological Tendency of Bonding for MEMS Device by Japanese Patent Research

Tadatomo Suga, Toshihiro Itoh, Hirotake Akaike, 2003 .

Forecasting the Next Electronic System-Integration Researching Phase I-Recent Activities of Electronic Packaging Consortium Imsi

Tadatomo Suga, 2001 .

Room temperature GaN-GaAs direct bonding by argon-beam surface activation

Yuichiro Tokuda, Tadatomo Suga, Eiji Higurashi, 2007, International Symposium on Optomechatronic Technologies.

Low-Temperature Au-to-Au Bonding for LiNbO3/Si Structure Achieved in Ambient Air

Tetsuya Kawanishi, Tadatomo Suga, Eiji Higurashi, 2007, IEICE Trans. Electron..

Disassemblability assessment for IM

Tadatomo Suga, 1999, Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing.

Low contact-force fritting probe card using buckling microcantilevers

Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka, 2003, International Test Conference, 2003. Proceedings. ITC 2003..

Proceedings of the First international conference on Environmentally conscious design and inverse manufacturing

Yasushi Umeda, Tadatomo Suga, Fumihiko Kimura, 1999 .

Nanomechanical Analysis of Polydimethylglutarimide Based Lift Off Resist Used for Temporary Bonding and Film Transfers

Tadatomo Suga, Helmut Baumgart, Yousuf Mohammed, 2016 .

Electronic System Integration -An Interim Report from the Advisory Committee of MITI

Tadatomo Suga, 1998 .

Canary devices for through-silicon vias a condition monitoring approach

Tadatomo Suga, Nils F. Nissen, Klaus-Dieter Lang, 2017, 2017 International Conference on Electronics Packaging (ICEP).

Transmission Line Power Supply for Over GHz Data Transmission

Tadatomo Suga, Chihiro Ueda, Kanji Otsuka, 2004 .

Special Issue on Nanometer-scale Machining and Processing Technology - From the Viewpoint of Chemical/Physical Reaction on Surfaces. Nanometer-scale Assembly Technology.

Tadatomo Suga, 1993 .

Current Status of Collaboration between Industry and Academic Institutions in Electronic Packaging

Tadatomo Suga, 2000 .

Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer

Tadatomo Suga, Ikuo Soga, Taisuke Iwai, 2015, Microelectron. Reliab..

Hybrid integration technologies for optical micro-systems

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2004, SPIE Optics East.

Low temperature bonding for 3D interconnects

Tadatomo Suga, Ryuichi Kondoh, 2012, 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International.

Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method

Tadatomo Suga, Eiji Higurashi, Ken Okumura, 2017, IEICE Trans. Electron..

Soft bump process for LSI probing

Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka, 2005 .

A Consideration on the Quantitative Disassembly Evaluation

Tadatomo Suga, Jun Fujimoto, Kennichi Saneshige, 1997 .

Spalling Technology of PZT Thin Film Capacitor using Internal Stress

Kazutaka Sueshige, Masaaki Ichiki, Tadatomo Suga, 2014 .

Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration

Takeshi Sato, Tadatomo Suga, Renshi Sawada, 2016, IEICE Trans. Electron..

Direct Wafer Bonding of SiC-SiC at Room Temperature by SAB Method

Tadatomo Suga, Haruo Nakazawa, Yoshikazu Takahashi, 2016 .

MEMS IC test probe utilizing fritting contacts

Herbert Reichl, Tadatomo Suga, Toshihiro Itoh, 2000, Design, Test, Integration, and Packaging of MEMS/MOEMS.

Microsensors and actuator arrays based on Pb(Zr,Ti)O3 thin film for AFM data storage

Ryutaro Maeda, Tadatomo Suga, Toshihiro Itoh, 2001, Other Conferences.

(Invited) Analysis of Defect Levels at GaAs/GaAs Surface-Activated Bonding Interface for Multi-Junction Solar Cells

Yoshiaki Nakano, Tadatomo Suga, Kentaroh Watanabe, 2016 .

Toward a New Era of The Japan Institute for Electronics Packaging

Tadatomo Suga, 2014 .

Air-gap structure between integrated LiNbO3 optical modulators and micromachined Si substrates.

Tetsuya Kawanishi, Tadatomo Suga, Eiji Higurashi, 2011, Optics express.

Active disassembly and reversible interconnection

Tadatomo Suga, Naoe Hosoda, N. Hosoda, 2000, Proceedings of the 2000 IEEE International Symposium on Electronics and the Environment (Cat. No.00CH37082).

Role of Heating on Plasma-Activated Silicon Wafers Bonding

Tadatomo Suga, Matiar M. R. Howlader, Minsung Kim, 2009 .

Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air

Tadatomo Suga, T. Suga, Yinghui Wang, 2008 .

Integrated micro laser Doppler velocimeter with 3-D structure

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2010, 2010 IEEE Sensors.

A novel approach to assembly and interconnection for micro electro mechanical systems

Tadatomo Suga, Naoe Hosoda, 1995, Proceedings IEEE Micro Electro Mechanical Systems. 1995.

Characteristics of sol-gel derived PZT thin films with lead oxide cover layers and lead titanate interlayers

Chengkuo Lee, Tadatomo Suga, Toshihiro Itoh, 1996, Journal of Materials Science.

Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 2003 .

Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment.

Takehiko Kitamori, Tadatomo Suga, Kihoon Jang, 2013, Lab on a chip.

Low-Temperature Solid-State Bonding Using Hydrogen Radical Treated Solder for Optoelectronic and MEMS Packaging

Tadatomo Suga, Eiji Higurashi, Hiromu Kawai, 2014 .

Room temperature bonding of silicon and lithium niobate

Tadatomo Suga, Matiar M. R. Howlader, Moon J. Kim, 2006 .

Development of a piezoelectric self-excitation and self-detection mechanism in PZT microcantilevers for dynamic scanning force microscopy in liquid

Chengkuo Lee, Ryutaro Maeda, Tadatomo Suga, 1997 .

A Release Property of High-Permittivity Thin Film Manufactured with Nano-Transfer Method

Masaaki Ichiki, Tadatomo Suga, Toshihiro Itoh, 2011 .

Review of Low-Temperature Bonding Technologies and Their Application in Optoelectronic Devices

Tadatomo Suga, Eiji Higurashi, T. Suga, 2016 .

Surface activated bonding of LCP/Cu for electronic packaging

Tadatomo Suga, Matiar M. R. Howlader, Kouji Nanbu, 2005 .

1.3 μm InGaAsP/InP lasers on GaAs substrate fabricated by the surface activated wafer bonding method at room temperature

Tadatomo Suga, Hideki Takagi, Naoe Hosoda, 1998 .

Piezoelectric Sensor for Detecting Force Gradients in Atomic Force Microscopy

Tadatomo Suga, Toshihiro Itoh, T. Itoh, 1994 .

Moiré method for nanoprecision wafer-to-wafer alignment: Theory, simulation and application

Tadatomo Suga, Chenxi Wang, T. Suga, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Low-temperature hermetic packaging for microsystems using Au–Au surface-activated bonding at atmospheric pressure

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2012 .

Panel-size component integration (PCI) with molded liquid crystal polymer (LCP) substrates

Tadatomo Suga, Jorma Kivilahti, James E. Morris, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method

Tadatomo Suga, H. Takagi, Yutaka Takahashi, 1992 .

ON THE INTERFACE CRACK MODELS

Tadatomo Suga, Siegfried Schmauder, G. Elssner, 1988 .

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1998 .

A novel moiré fringe assisted method for nanoprecision alignment in wafer bonding

Tadatomo Suga, Chenxi Wang, T. Suga, 2009, Electronic Components and Technology Conference.

Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2008 .

Wafer level sealing characterization method using Si micro cantilevers

Hironao Okada, Tadatomo Suga, Toshihiro Itoh, 2008 .

Mechanochemical Polishing of Silicon Carbide Single Crystal with Chromium(III) Oxide Abrasive

Tadatomo Suga, Yoshio Bando, Shigenobu Suzuki, 1992 .

Room temperature GaAsSi and InPSi wafer direct bonding by the surface activated bonding method

Tadatomo Suga, Naoe Hosoda, Taek Ryong Chung, 1997 .

Interfacial Behavior of Surface Activated p-GaP/n-GaAs Bonded Wafers at Room Temperature

Tadatomo Suga, Matiar M. R. Howlader, Taehun Lee, 2010 .

Room-temperature wafer bonding using smooth gold thin films for wafer-level MEMS packaging

Tadatomo Suga, Eiji Higurashi, Kei Hagiwara, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Room temperature wafer level glass/glass bonding

Tadatomo Suga, Matiar M. R. Howlader, T. Suga, 2006 .

Surface activated bonding of copper through silicon vias and gold stud bumps at room temperature

Tadatomo Suga, Matiar M. R. Howlader, Akira Yamauchi, 2011 .

Characteristics of Low Force Contact Process for MEMS Probe Cards

Tadatomo Suga, Toshihiro Itoh, Kenichi Kataoka, 2002 .

Noncontact scanning force microscopy using a direct‐oscillating piezoelectric microcantilever

Tadatomo Suga, T. Itoh, T. Itoh, 1996 .

Isothermal Fatigue Properties of Sn–Ag–Cu Alloy Evaluated by Micro Size Specimen

Tadatomo Suga, Yoshiharu Kariya, T. Suga, 2005 .

Surface activated bonding between bulk single crystal diamond and bulk aluminum

Tadatomo Suga, Naoe Hosoda, Masahisa Fujino, 2015 .

Homogenizing and Applying Dielectric Film to Wafer-Level Film Preparation

Kazutaka Sueshige, Masaaki Ichiki, Tadatomo Suga, 2012 .

Room temperature Cu–Cu direct bonding using surface activated bonding method

Tadatomo Suga, Toshihiro Itoh, Matiar M. R. Howlader, 2003 .

Deflection detection and feedback actuation using a self‐excited piezoelectric Pb(Zr,Ti)O3 microcantilever for dynamic scanning force microscopy

Chengkuo Lee, Tadatomo Suga, T. Itoh, 1996 .

Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 2001 .

Feasibility of surface activated bonding for ultra-fine pitch interconnection-a new concept of bump-less direct bonding for system level packaging

Tadatomo Suga, T. Suga, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Room-temperature wafer bonding with smooth Au thin film in ambient air using Ar RF plasma activation

Tadatomo Suga, Eiji Higurashi, Kei Hagiwara, 2014, 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D).

Force sensing microcantilever using sputtered zinc oxide thin film

Tadatomo Suga, Toshihiro Itoh, T. Itoh, 1994 .

Novel multibridge-structured piezoelectric microdevice for scanning force microscopy

Ryutaro Maeda, Tadatomo Suga, Toshihiro Itoh, 2000 .

Low-temperature direct bonding of glass nanofluidic chips using a two-step plasma surface activation process

Takehiko Kitamori, Tadatomo Suga, Kihoon Jang, 2011, Analytical and Bioanalytical Chemistry.

Direct bonding of high dielectric oxides for high-performance transistor applications

Tadatomo Suga, Yanhong Tian, Chenxi Wang, 2020 .

Relationship between Diffusion and Adhesion Properties of Ferroelectric Thin-Film Structure on Releasable Substrate

Masaaki Ichiki, Tadatomo Suga, Toshihiro Itoh, 2013 .

Development of a New Mechanochemical Polishing Method with a Polishing Film for Ceramic Round Bars

Tadatomo Suga, T. Uematsu, A. Kobayashi, 1992 .

Piezoelectric cantilever array for multiprobe scanning force microscopy

Tadatomo Suga, T. Itoh, T. Itoh, 1996, Proceedings of Ninth International Workshop on Micro Electromechanical Systems.

Surface activation-based nanobonding and interconnection at room temperature

Tadatomo Suga, Matiar M. R. Howlader, Akira Yamauchi, 2011 .

A Combined Process of Formic Acid Pretreatment for Low-Temperature Bonding of Copper Electrodes

Tadatomo Suga, Masahisa Fujino, Wenhua Yang, 2013 .

Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Tadatomo Suga, Yoshiharu Kariya, Masahisa Otsuka, 2005 .

Direct bonding and debonding of glass wafers for handling of ultra-thin glass sheets

Tadatomo Suga, Masahisa Fujino, Kai Takeuchi, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Broadband MEMS shunt switches using PZT/HfO2 multi-layered high k dielectrics for high switching isolation

Ryutaro Maeda, Tadatomo Suga, Jiunnjye Tsaur, 2005 .

Characterization of micromachined piezoelectric PZT force sensors for dynamic scanning force microscopy

Chengkuo Lee, Ryutaro Maeda, Tadatomo Suga, 1997 .

Necessary load for room temperature vacuum sealing

Tadatomo Suga, Toshihiro Itoh, T. Itoh, 2005 .

Low temperature Au-Au surface-activated bonding using nitrogen atmospheric-pressure plasma treatment for optical microsystems

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2015, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC).

Room-temperature direct bonding of silicon and quartz glass wafers

Yuan Wang, Tadatomo Suga, Yanhong Tian, 2017 .

Novel hydrophilic SiO2 wafer bonding using combined surface-activated bonding technique

Tadatomo Suga, Ran He, Masahisa Fujino, 2015 .

Low-temperature bonding of laser diode chips on Si substrates with oxygen and hydrogen atmospheric-pressure plasma activation

Tadatomo Suga, Renshi Sawada, Eiji Higurashi, 2009, 2009 International Conference on Electronic Packaging Technology & High Density Packaging.

Wafer direct bonding of compound semiconductors and silicon at room temperature by the surface activated bonding method

Tadatomo Suga, Naoe Hosoda, Taek Ryong Chung, 1997 .

Scanning force microscope using a piezoelectric microcantilever

Tadatomo Suga, Toshihiro Itoh, T. Itoh, 1994 .

Active disassembly of bonded wafers

Tadatomo Suga, D. Kasa, 1999, Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing.

Transmission Electron Microscope Observations of Si/Si Interface Bonded at Room Temperature by Ar Beam Surface Activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1999 .

An Electrode Structure for Ferroelectric Thin Films and Its Application to the Nanotransfer Method

Masaaki Ichiki, Tadatomo Suga, Toshihiro Itoh, 2011 .

Influence of ceramic surface treatment on peel-off strength between aluminum nitride and epoxy-modified polyaminobismaleimide adhesive

Tadatomo Suga, Nobuo Iwase, Hironori Asai, 2001 .

Room-temperature direct bonding of CMP-Cu film for bumpless interconnection

Tadatomo Suga, T. Itoh, Naoe Hosoda, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Room-Temperature Bonding of Si Wafers to Pt Films on SiO2 or LiNbO3 Substrates Using Ar-Beam Surface Activation

Ryutaro Maeda, Tadatomo Suga, Hideki Takagi, 1999 .

Void-Free Room-Temperature Silicon Wafer Direct Bonding Using Sequential Plasma Activation

Tadatomo Suga, Eiji Higurashi, Chenxi Wang, 2008 .

Sol-gel derived PZT force sensor for scanning force microscopy

Chengkuo Lee, Tadatomo Suga, Toshihiro Itoh, 1996 .

Investigation of the bonding strength and interface current of p-Si/n-GaAs wafers bonded by surface activated bonding at room temperature

Tadatomo Suga, Matiar M. R. Howlader, T. Suga, 2001 .

Preparation and Properties of Piezoelectric Lead Zirconate Titanate Thin Films for Microsensors and Microactuators by Sol-Gel Processing

Tadatomo Suga, Toshihiro Itoh, Gen Sasaki, 1996 .

Investigation of bonding strength and sealing behavior of aluminum/stainless steel bonded at room temperature

Tadatomo Suga, Matiar M. R. Howlader, T. Kaga, 2010 .

Study on Homogeneous Wafer Level Dielectric Film Preparation Using Chemical Solution Deposition Method

Kazutaka Sueshige, Masaaki Ichiki, Tadatomo Suga, 2013 .

Surface Activated Bonding-An Approach to Joining at Room Temperature

Tadatomo Suga, T. Suga, 1993 .

Direct Cu to Cu Bonding and Other Alternative Bonding Techniques in 3D Packaging

Tadatomo Suga, Antonio La Manna, Ran He, 2017 .

A lamination technique of LCP/Cu for electronic packaging

Tadatomo Suga, Matiar M. R. Howlader, A. Takahashi, 2002, 2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599).

A new bumping process using lead-free solder paste

Tadatomo Suga, T. Suga, K. Saito, 2002 .

Characteristics of fritting contacts utilized for micromachined wafer probe cards

Herbert Reichl, Tadatomo Suga, Toshihiro Itoh, 2000 .

Micromachined Silicon Disk Resonator Transduced by Piezoelectric Lead Zirconate Titanate Thin Films

Ryutaro Maeda, Tadatomo Suga, Toshihiro Itoh, 2010 .

Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation

Tadatomo Suga, Chenxi Wang, T. Suga, 2011 .

Surface activated bonding of GaAs and SiC wafers at room temperature for improved heat dissipation in high-power semiconductor lasers

Tadatomo Suga, Eiji Higurashi, T. Suga, 2015 .

Room-temperature bonding method for polymer substrate of flexible electronics by surface activation using nano-adhesion layers

Tadatomo Suga, Masahisa Fujino, Takashi Matsumae, 2015 .