Xiaopeng Xu

Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation

Sesh Ramaswami, John O. Dukovic, Aditya P. Karmarkar, 2010 .

Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling

Tommaso Cilento, Chan-Su Yun, Arsen Terterian, 2013 .