Olaf van der Sluis

The need for multi-scale approaches in Cu/low-k reliability issues

Willem D. van Driel, G. Q. Zhang, Cadmus A. Yuan, 2008, Microelectron. Reliab..

Reliability modelling for packages in flexible end-products

Willem D. van Driel, G. Q. Zhang, Dao-Guo Yang, 2006, Microelectron. Reliab..

Multiscale modelling of multilayer substrates

Willem D. van Driel, G. Q. Zhang, Olaf van der Sluis, 2006, Microelectron. Reliab..

Design and implementation of flexible and stretchable systems

Bart Vandevelde, Jan Vanfleteren, Frederick Bossuyt, 2011, Microelectron. Reliab..

A fast moisture sensitivity level qualification method

Xiaosong Ma, Hélène Frémont, Willem D. van Driel, 2010, Microelectron. Reliab..

Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

G. Q. Zhang, Olaf van der Sluis, R. A. B. Engelen, 2009, Microelectron. Reliab..

Characterization of semiconductor interfaces using a modified mixed mode bending apparatus

Willem D. van Driel, Marc G. D. Geers, Olaf van der Sluis, 2008, Microelectron. Reliab..

Analysis of Cu/low-k bond pad delamination by using a novel failure index

G. Q. Zhang, Olaf van der Sluis, J. H. J. Janssen, 2005, EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005..

Characterization of moisture properties of polymers for IC packaging

Xiaosong Ma, Willem D. van Driel, G. Q. Zhang, 2007, Microelectron. Reliab..

Molecular simulation on the material/interfacial strength of the low-dielectric materials

Willem D. van Driel, G. Q. Zhang, Cadmus A. Yuan, 2007, Microelectron. Reliab..

Prediction of the epoxy moulding compound aging effect on package reliability

Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, 2010, Microelectron. Reliab..

Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion

Willem D. van Driel, Olaf van der Sluis, R. A. B. Engelen, 2007, Microelectron. Reliab..

Numerical prediction of failure paths at a roughened metal/polymer interface

G. Q. Zhang, Olaf van der Sluis, P. H. M. Timmermans, 2009, Microelectron. Reliab..

Cohesive zone modeling for structural integrity analysis of IC interconnects

Marc G. D. Geers, Olaf van der Sluis, Ron H. J. Peerlings, 2007, Microelectron. Reliab..

Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions

Willem D. van Driel, G. Q. Zhang, Olaf van der Sluis, 2006, Microelectron. Reliab..

Advances in delamination modeling of metal/polymer systems: atomistic aspects

Jianmin Qu, Cadmus Yuan, Willem van Driel, 2018 .