H. C. Cheng

An Effective Thermal-mechanical Modeling Methodology for Large-scale Area Array Typed Packages

W. H. Chen, W. Chen, C. Y. Yu, 2005 .

First-principles density function calculations of physical properties of triclinic Cu7In3

W. Chen, H. C. Cheng, C. F. Yu, 2016, 2016 International Conference on Electronics Packaging (ICEP).

Mechanical Properties of Carbon Nanotubes Using Molecular Dynamics Simulations with the Inlayer van der Waals Interactions

W. Chen, H. C. Cheng, Y. Hsu, 2007 .

Superior damage-immunity of thin oxides thermally grown on reactive-ion-etched silicon surface in N/sub 2/O ambient

T. Chao, W. Chen, H. C. Cheng, 1994 .

Mechanical Properties of Carbon Nanotubes Using Molecular Dynamics Simulations with the Inlayer van der Waals Interactions

W. Chen, H. C. Cheng, Y. Hsu, 2007 .