Jinhu Fan
发表
T. Shi,
G. Liao,
Tianxiang Li,
2017
.
T. Shi,
G. Liao,
Zirong Tang,
2018
.
T. Shi,
G. Liao,
Zirong Tang,
2019,
Journal of Alloys and Compounds.
T. Shi,
G. Liao,
Zirong Tang,
2017,
Journal of Materials Science: Materials in Electronics.
T. Shi,
G. Liao,
Tianxiang Li,
2017
.
Low-Temperature and Low-Pressure Cu-Cu Bonding by Pure Cu Nanosolder Paste for Wafer-Level Packaging
T. Shi,
G. Liao,
Zirong Tang,
2017,
2017 IEEE 67th Electronic Components and Technology Conference (ECTC).
T. Shi,
G. Liao,
Zirong Tang,
2016
.
T. Shi,
Tianxiang Li,
Zirong Tang,
2018,
Journal of Electronic Materials.
T. Shi,
G. Liao,
Zirong Tang,
2018
.
T. Shi,
G. Liao,
Zirong Tang,
2017,
Nanoscale Research Letters.
Zirong Tang,
Jinhu Fan,
Jie Wang,
2021,
2021 22nd International Conference on Electronic Packaging Technology (ICEPT).