H. Toy

An efficient lid design for cooling stacked flip-chip 3D packages

J. Wakil, Hsichang Liu, K. Sikka, 2012, 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems.

A Practical Implementation of Silicon Microchannel Coolers for High Power Chips

M. Gaynes, J. Wakil, E. Colgan, 2007, IEEE Transactions on Components and Packaging Technologies.