Stan Filipiak

Metrology Of Silicide Contacts For Future CMOS

Aaron Thean, Bill Taylor, Victor H. Vartanian, 2007 .

Integration of SiCN as a low /spl kappa/ etch stop and Cu passivation in a high performance Cu/low /spl kappa/ interconnect

Ertugrul Demircan, Larry Zhao, Steve Park, 2002, Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519).