J. Pradelles

发表

Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approach

H. Grampeix, S. Barnola, M. Darnon, 2015, Advanced Lithography.

New writing strategy in electron beam direct write lithography to improve critical dense lines patterning for sub-45nm nodes

Laurent Pain, Luc Martin, B. Icard, 2009, European Mask and Lithography Conference.

On the Optimization of Ebeam Lithography Using Hydrogen Silsesquioxane (HSQ) for Innovative Self-Aligned CMOS Process

Stephane Monfray, Frederic Boeuf, Thomas Skotnicki, 2013 .

Grating enhanced MOEMS: a novel class of beam steering devices

J. Pradelles, Michel Garrigues, P. Viktorovitch, 2005, SPIE Microtechnologies.

Contact holes patterning by directed self-assembly of block copolymers: What would be the Bossung plot?

S. Barnola, X. Chevalier, R. Tiron, 2014, Advanced Lithography.

Scaling-down lithographic dimensions with block-copolymer materials: 10nm-sized features with PS-b-PMMA

G. Cunge, X. Chevalier, R. Tiron, 2013, Advanced Lithography.

MAPPER alignment sensor evaluation on process wafers

G. de Boer, N. Vergeer, J. Pradelles, 2013, Advanced Lithography.

Scaling-down lithographic dimensions with block-copolymer materials: 10-nm-sized features with poly(styrene)-block-poly(methylmethacrylate)

Christophe Navarro, Maxime Argoud, Gilles Cunge, 2013 .

Nanoimprint, DSA, and multi-beam lithography: patterning technologies with new integration challenges

F. Delachat, M. May, H. Teyssedre, 2017, Advanced Lithography.

Multiple pass exposure in e-beam lithography: application to the sub-22nm nodes

S. Manakli, L. Pain, A. Poncet, 2010, Advanced Lithography.

Pattern density multiplication by direct self assembly of block copolymers: toward 300mm CMOS requirements

Christophe Navarro, L. Pain, Christophe Couderc, 2012, Advanced Lithography.

New alignment marks for improved measurement maturity

S. Manakli, L. Pain, U. Weidenmueller, 2008, European Mask and Lithography Conference.

Development of multiple pass exposure in electron beam direct write lithography for sub-32nm nodes

A. Poncet, Laurent Pain, Luc Martin, 2009, Photomask Technology.

Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond

S. Barnola, R. Tiron, S. Barraud, 2014, Advanced Lithography.

Sub-20nm hybrid lithography using optical, pitch-division, and e-beam

L. Pain, S. Barnola, B. Icard, 2012, Advanced Lithography.

Ω-Gate Nanowire Transistors Realized by Sidewall Image Transfer Patterning: 35nm Channel Pitch and Opportunities for Stacked-Nanowires Architectures

Yves Morand, Stephane Monfray, Frederic Boeuf, 2015 .

Probing Self-Assembly of Cylindrical Morphology Block Copolymer Using in Situ and ex Situ Grazing Incidence Small-Angle X-ray Scattering: The Attractive Case of Graphoepitaxy

Christophe Navarro, Raluca Tiron, Xavier Chevalier, 2014 .

Progress and process improvements for multiple electron-beam direct write

Pieter Brandt, Isabelle Servin, Ludovic Lattard, 2017 .

Innovative through-Si 3D lithography for ultimate self-aligned planar Double-Gate and Gate-All-Around nanowire transistors

O. Faynot, G. Ghibaudo, A. Pofelski, 2013, 2013 Symposium on VLSI Technology.