C. Kang

发表

An Evaluation of Ti-Based Metal Gate Electrodes on Hf-Silicate Dielectrics for Dual-Metal-Gate Applications

R. Singh, Purushottam Kumar, Hyung-Suk Jung, 2008 .

Analysis of gate oxide damage by ultraviolet light during oxide deposition in high density plasma

Myeong-cheol Kim, C. Kang, Dong Kwon Kim, 2011 .

Properties of aluminium oxide films prepared by plasma-enhanced metal-organic chemical vapour deposition

W. J. Lee, C. Kang, J. Chun, 1990 .

Substrate temperature effects on 193nm photoresist deformation and self-aligned contact hole etching performances

Han-Ku Cho, Myeong-cheol Kim, C. Kang, 2006 .

Study of interface degradation of Hf-silicate gate dielectrics during thermal nitridation process

R. Singh, J. H. Jang, J. Yuh, 2009 .

Effects of various plasma pretreatments on 193 nm photoresist and linewidth roughness after etching

Han-Ku Cho, Denis Shamiryan, Werner Boullart, 2006 .

Etching characteristics of photoresist and low-k dielectrics by Ar/O2 ferrite-core inductively coupled plasmas

C. Chung, Young‐Chang Joo, Hyoun-woo Kim, 2008 .

Study of ashing for low-k dielectrics using the N2/O2 ferrite-core inductively coupled plasmas

C. Chung, Hyoun-woo Kim, H. Lee, 2006 .

Photoresist ashing in nitrogen gas using ferrite core inductively coupled plasmas

C. Chung, Hyoun-woo Kim, W. Park, 2005 .

Application of N2/Ar inductively coupled plasma → the photoresist ashing for low-k dielectrics

Jaegab Lee, C. Chung, Hyoun-woo Kim, 2005 .

Patterning of W/WN x /poly-Si gate electrode using Cl 2 /O 2 plasmas

J. Moon, Hyoun-woo Kim, C. Kang, 2003 .

Patterning of Ru electrode in O2/Cl2 gas using reactive ion etcher

Hyoun-woo Kim, C. Kang, B. Ju, 2003 .

CHEMICAL VAPOR DEPOSITION OF TITANIUM CARBIDE ON AISI M2 TOOL STEELS AND Si3N4-TiC CERAMIC COMPOSITE

C. O. Park, D. W. Kim, C. Kang, 1990 .

Study of plasma charging-induced white pixel defect increase in CMOS active pixel sensor

Han-Ku Cho, Joo-Tae Moon, Chang-Jin Kang, 2007 .

Aspect ratio dependent plasma-induced charging damage in rf precleaning of a metal contact

J. Moon, Jong Min Kim, Y. J. Kim, 2001 .

Etching characteristics and modeling for oval-shaped contact

J. Moon, Sung‐Chan Park, C. Kang, 2007 .

Evaluation of plasma-induced charging damage on metal contact process

J. Moon, Ji-Soo Kim, W. Park, 1999, ICVC '99. 6th International Conference on VLSI and CAD (Cat. No.99EX361).

Sub-0.1 μm nitride hard mask open process without precuring the ArF photoresist

J. Moon, W. S. Lee, J. Kim, 2003 .

An evaluation of thermal stability of TiB2 metal gate on Hf silicate for p-channel metal oxide semiconductor application

S. Son, K. Min, C. Kang, 2008 .

Chamber maintenance and fault detection technique for a gate etch process via self-excited electron resonance spectroscopy

Han-Ku Cho, Chang-Jin Kang, Young-Jae Jung, 2005 .

Enhancement of Mask Selectivity in SiO2 Etching with a Phase-Controlled Pulsed Inductively Coupled Plasma

C. O. Jung, C. Kang, K. Shin, 1998 .

Exposed area ratio dependent etching in a submicron self-aligned contact etching

Woo-Sung Han, Chang-Jin Kang, J. Moon, 2002 .

Characteristics of self bias voltage and poly-Si etching in pulsed helicon wave plasma

J. Moon, C. Kang, T. Ahn, 1999 .

High temperature platinum etching using Ti mask layer

J. Moon, B. Nam, Moonyong Lee, 1999 .

Patterning issues for the fabrication of sub-micron memory capacitors' electrodes

Hyoun Woo Kim, Chang-Jin Kang, Hyoun-woo Kim, 2003, Microelectron. J..

Investigation into patterning of a stack-type Ru electrode capacitor

Hyoun-woo Kim, C. Kang, 2003 .

Study of Ru etching using O2/Cl2 helicon plasmas

J. Moon, Hyoun-woo Kim, Jae Hyun Han, 2002 .