I. Sauciuc

Characteristics of two-phase closed thermosiphons for medium temperature heat recovery applications

Ioan Sauciuc, Aliakbar Akbarzadeh, A. Akbarzadeh, 1995 .

LEAKAGE POWER: PHYSICAL MECHANISMS AND POSSIBLE SOLUTIONS

I. Sauciuc, Rei Yamamoto, J. Čulić-Viskota, 2014 .

Spreading in the heat sink base: phase change systems or solid metals??

Ioan Sauciuc, Ravi Mahajan, Gregory M. Chrysler, 2002 .

Carbon based Thermal Interface Material for high performance cooling applications

Ioan Sauciuc, I. Sauciuc, Rei Yamamoto, 2014, Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

The design and testing of the super fiber heat pipes for electronics cooling applications

K. Mashiko, Y. Saito, M. Mochizuki, 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

Use of heat pipe/heat sink for thermal management of high performance CPUs

Yuji Saito, Koichi Mashiko, Masataka Mochizuki, 2000, Sixteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.00CH37068).

Thermal Devices Integrated With Thermoelectric Modules With Applications to CPU Cooling

Ioan Sauciuc, Ravi Mahajan, Hakan Erturk, 2005 .

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Mahajan, Hakan Erturk, 2005 .

Thermal performance of thermoelectric cooler (tec) integrated heat sink and optimizing structure for low acoustic noise / power consumption

Y. Kimura, M. Ikeda, T. Nakamura, 2006, Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium.