G. Schwinn

New dicing and thinning concept improves mechanical reliability of ultra thin silicon

C. Landesberger, Rolf Aschenbrenner, Gerhard Klink, 2001, Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C. Alder, Christof Landesberger, 2003 .