T. Katata

High performance Al dual damascene process with elevated double stoppers

M. B. Anand, H. Shibata, Y. Oikawa, 1998, Proceedings of the IEEE 1998 International Interconnect Technology Conference (Cat. No.98EX102).

Copper filling contact process to realize low resistance and low cost production fully compatible to SOC devices

K. Yoshida, T. Fujimaki, F. Matsuoka, 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

High-resolution electron-microscopic in situ observation of the motion of intervariant interfaces in Cu―Zn―Al thermoelastic martensite

H. Saka, T. Katata, 1989 .

Development of stable PZT sputtering process using ex-situ crystallization and PZT/Pt interface control technique

T. Katata, K. Yamakawa, K. Okuwada, 1998, ISAF 1998. Proceedings of the Eleventh IEEE International Symposium on Applications of Ferroelectrics (Cat. No.98CH36245).